NOW THERE ARE A QUICK HANDBOOK, A EASY GUIDE,
AND TWO POCKET GUIDE
FAILURE ANALYSIS OF ELECTRONIC PROCESSES
(almost 500 pages)
FAILURE ANALYSIS OF PCB ASSEMBLY
(more than 220 pages)
FAILURE ANALYSIS OF PCB
(more than 200 pages)
The questions are :
WHERE is located the fault ?
WHAT they have been the first cause ?
HOW has been determined ? (what is the failure mode ?)
The confirms of the correctness of answers to these questions MUST always come from laboratory tests.
And while I do this :
WHICH TOOL should I use ?
WHICH TEST should I choose ?
What you will learn:
The objective of these HANDBOOKs is to prepare the readers to make informed decisions when a PCB or Assembly problem exist.
Who will it benefit:
The skills learned in these HANDBOOKs are beneficial to materials and process engineers, quality control engineers, failure analysis engineers and manufacturing engineers.